BENDABLE CIRCUIT BOARD AND MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a bendable circuit board with high reliability and durability at low cost and its manufacturing method with respect to a bendable board. SOLUTION: The bendable circuit board includes a plurality of insulating bodies 2 arranged with a space in between for making a hollow part 3 at the bending part of the board, and a conductive body 1 bridged over the insulating bodies 2 on both sides and held by the insulating bodies 2. The bendable circuit board can be bent at the hollow part 3 as the bending part thereof.