| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum processor in which film deposition does not occur in the vicinity of each opening that leads to a transfer chamber in a film forming chamber. SOLUTION: This vacuum processor 1 has vacuum chambers 51-56 and a loading/unloading chamber 57, which respectively have first chambers 31-37 and second chambers 41-47. A vacuum valve is arranged inside each of the second chambers 41-47, and each vacuum valve opens/closes a first opening arranged between each of the first chambers 31-37 and respective each of the second chambers 41-47 to enable connection/isolation between each of the inside of the first chambers 31-37 and the inside of the transfer chamber 2. Since the transfer chamber 2 and each of the first chambers 31-37 are not directly connected, each temperature in the vicinity of the first opening inside the first chambers 31-37 does not descend even if the transfer chamber 2 is cooled for purpose of protecting a transfer robot, and the film deposition due to the temperature lowering does not occur. |
