| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board for electronic parts which prevents the leakage of ultraviolet rays at exposure, or the creep in of electrolytic copper plating liquid caused by poor adhesion of a dry film at formation of a wiring pattern, by removing the unevenness on the surface of an insulating resin layer along the unevenness on the surface of a lower wiring pattern. SOLUTION: A method of manufacturing a multilayer wiring board 11 for electronic parts, where wiring patterns 14, 19, and 22 are made severally and which has a plurality of insulating resin layers 17 and 21 being equipped with vias 20 and 20a electrically connecting the upper and lower wiring patterns 14, 19, and 20, has a process of applying insulating resin to the wiring patterns 14 and 19, and drying it, and pressurizing the surface of that insulating resin. |
