METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the dimensional accuracy of a transferred pattern. SOLUTION: A prescribed pattern is transferred onto a semiconductor wafer by performing exposure by using a photomask 2 on which the most proximate light transmitting areas PA1 and PA2 in a pattern for forming a mask pattern are laid out in a direction in which the areas PA1 and PA2 are hardly affected by the aberration of the optical system of an aligner.