| 摘要 |
PROBLEM TO BE SOLVED: To allow a PTP to be easily mounted, without need for a special facility in a semiconductor device, having the PTP mounted on a mother board. SOLUTION: Au stud bumps 14 are respectively formed, for example, at ends of Cu leads 12 wired to a PET film 11 of a contact part of the PTP 10. Meanwhile, holes 21, in response to diameters of the bumps 14 are formed at positions corresponding to the contact parts of the mother board 20. At mounting time, the respective bumps 14 on the PTP 10 are engaged with the holes 21 on the board 20. Thus, mounting of the PTP 10 on the board 20 an be conducted without reflowing or the like. |
