| 摘要 |
PURPOSE: A semiconductor stack structure is provided to simplify a structure and to reduce manufacturing cost, a heating value and electrical consumption, by stacking a plurality of dies to make the dies have a step difference, and by making an end portion of the circuit on the dies exposed to the exterior. CONSTITUTION: A plurality of dies(10,12) on which a circuit is formed, is stacked to increase integration of a semiconductor. At least one side of the circumferential portion of the dies is of a step difference, and a part of the circuit formed on the dies is exposed to the exterior by the step difference so that the circuits exposed to the exterior can be interconnected.
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