| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device and its wire bonding method where two semiconductor laser elements and a monitor PD are easily mounted in a mall package as well as a manufacturing process is simplified with a simple configuration. SOLUTION: There are provided a stem 100 comprising a plurality of lead 121-124, a sub-mount 160 die-bonded on the stem 100 with a monitor PD 140 integrally formed on its surface, and two semiconductor laser elements 131 and 132, die-bonded on the sub-mount 160 and mounting emitted light with the monitor PD 140. A first bonding surface (anode electrode 183) of the monitor PD 140 is wire-bonded to a second bonding surface (end surface 123a) of the lead pin 123 almost perpendicular to the first bonding surface. |
