发明名称 METHOD FOR FORMING SEMICONDUCTOR SILICIDE FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for forming a high mobility semiconductor silicide film in which an epitaxial semiconductor silicide film can be formed easily without causing any aggregation even during high temperature annealing for enhancing crystallinity. SOLUTION: The method for forming a semiconductor silicide film comprises a step for forming aβ-FeSi2 epitaxial growth film 2 on a silicon substrate 1 in order to arrange the crystal orientation of the film, a step for forming a multilayer Si/Fe film 3 by deposition on theβ-FeSi2 epitaxial growth film 2, a step for forming an SiO2 cap layer 4 by deposition on the multilayer Si/Fe film 3 in order to suppress aggregation, and a step for forming aβ-FeSi2 epitaxial growth film 5 by annealing.</p>
申请公布号 JP2001267268(A) 申请公布日期 2001.09.28
申请号 JP20000080066 申请日期 2000.03.22
申请人 JAPAN SCIENCE & TECHNOLOGY CORP 发明人 SUEMASU TAKASHI
分类号 H01L21/285;H01L21/20;H01L21/28;H01L31/04;(IPC1-7):H01L21/285 主分类号 H01L21/285
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