发明名称 |
DEVICE FOR BONDING CHIP ON GLASS IN LIQUID CRYSTAL DISPLAY DEVICE |
摘要 |
PURPOSE: A device for bonding chip on glass in LCD(liquid crystal display) device is provided to reduce an interference of a signal generated inter data line by sticking an LCD drive chip on a glass of an LCD device directly. CONSTITUTION: A bonding head unit(51) and a worktable unit is connected with a chip carriage unit(50). A robot unit(48) operates in X-Y axis. A bonding head assembled in the bonding head unit(51) descends on a slide in case the robot unit(48) supplies with an IC(integrated circuit) chip. The IC chip is bonded on a glass for an appointed second in an appointed range of temperature. A camera(47) is stuck to a stage bracket connected with a plate stage of the worktable unit, and displays a position arrangement state of the glass and the IC chip on a monitor. |
申请公布号 |
KR20010088671(A) |
申请公布日期 |
2001.09.28 |
申请号 |
KR20010049961 |
申请日期 |
2001.08.20 |
申请人 |
SEMICON ENGINEERING CO., LTD. |
发明人 |
AHN, DONG CHEOL |
分类号 |
G02F1/13;G02F1/133;H01L21/603 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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