| 摘要 |
PROBLEM TO BE SOLVED: To provide a module in which a soldering state can be easily checked after being mounted. SOLUTION: Conductive patterns formed on the top and bottom surfaces of a resin substrate 1 are electrically connected to each other through a through hole electrode 2a. A through hole electrode 6a for external connection is formed on one side of the substrate 1. A light emitting device 3 and a photodetector 4 are mounted on the top surface of substrate 1 and an IC chip 5 is mounted on the bottom side, the top surfaces of both the devices 3, 4 are sealed with a transparent sealing resin 7, the IC chip 5 is sealed with a potting resin 7, and a frame substrate 14 is fixed to the bottom surface of the substrate 1 with a conductive adhesive or an adhesive 16. The opening 14a of the substrate 14 is closed with a magnetic shielding plate 10. The substrate 14 has a through hole electrode 15a for external connection communicating with the electrode 6a formed on the substrate 1. The electrode 15a of the substrate 14 is connected to the electrode 6a of the substrate 1 and is extended to the back surface of the module. This makes it possible to ensure reliable soldering and to easily check the soldering state. |
