| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized thin piezoelectric device, having satisfactory bonding characteristics of a flip-chip bonded semiconductor integrated circuit to a base, high resistance to a mechanical shock, a thermal shock or the like ad high reliability at a low cost, in device containing the integrate circuit and a piezoelectric vibrator in a package. SOLUTION: The surface mount piezoelectric device comprises a semiconductor integrated circuit, a piezoelectric vibrator contained in the package. In this case, the integrated circuit is bonded to a circuit board with a resin adhesive. The device uses a structure using a silicone conductive adhesive having a stress relaxation at the bonded part of an electrode pattern to a bump. |
