| 摘要 |
PROBLEM TO BE SOLVED: To form fine thin-film patterns which are heretofore difficult to be manufactured by the technique using the conventional photolithography with high throughput. SOLUTION: In a method for forming an upper magnetic pole layer of a thin-film magnetic head, an electrode layer 21 is first deposited on a substrate 20. Next, a first resist layer 31 is formed on the electrode layer 21 and is exposed and developed. A second resist layer 32 is formed on the electrode layer 21 and the first resist layer 31 and is exposed by, for example, electron beams. The first resist layer 31 is again exposed and the development of the second resist layer 32 and the development of the first resist layer 31 are executed. The upper magnetic pole layer is formed by a frame plating method using a frame formed in the manner described above. The end on the inner peripheral side of the frame is regulated by the second resist layer 32 and the end on the outer peripheral side is regulated by the first resist layer 31. |
