SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate treating method in which the treatment dura tion is saved to reduce the running cost when the substrate treated with an organic peeling liquid is cleaned and to provide a substrate treating device which is miniaturized to reduce the running cost by performing the method. SOLUTION: Pure water is supplied and stored in a treatment chamber 2, further supplied to overflow and the overflow pure water is drained as waste water through a drain pipe 64. Under the condition a middle shutter 8 is opened, a substrate lifter 11 is made to descend to the immersed position where whole the substrate is immersed under the liquid surface of the pure water by driving a lifting and lowering device 12 and the substrate is immersed into the overflow pure water during a required period by lowering the overflow pure water.