发明名称 |
CHIP TYPE SOLID ELECTROLYTIC CAPACITOR |
摘要 |
<p>PROBLEM TO BE SOLVED: To raise a volumetric efficiency and to reduce in size and to improve operability by surely connecting a lead wire for an anode to an anode terminal. SOLUTION: An anode terminal 4 formed of a lead frame is provided through an insulating board 8. A cathode terminal 10 arrived from a front surface of the board 8 at a rear surface side through a side face is formed of a conductive film. The board 8 is arranged on a lower surface of a capacitor element 3. The terminal 4 is connected directly to a lead wire 2 for the anode by laser welding. And, the terminal 10 is connected to a silver layer 26 of the element 3 via a conductive adhesive 7.</p> |
申请公布号 |
JP2001267180(A) |
申请公布日期 |
2001.09.28 |
申请号 |
JP20000078349 |
申请日期 |
2000.03.21 |
申请人 |
HITACHI AIC INC |
发明人 |
NARITA TAKAHIRO;IIZUKA KAZUYA;ITO TOYOSHI;KITAMURA TOSHIKI;HANNO KAZUHIKO;SATO TAKESHI |
分类号 |
B23K11/00;B23K26/00;B23K26/20;B23K26/21;B23K101/36;H01G9/004;H01G9/10;H01G13/00;(IPC1-7):H01G9/004 |
主分类号 |
B23K11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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