发明名称 METHOD OF MANUFACTURING CIRCUIT BOARD FOR DISPLAY
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board for liquid crystal drives at a low cost with a high yield by manufacturing circuit chips cut out of a silicon substrate and transferring the cut circuit chips to another board. SOLUTION: A mask, having openings precisely formed to fit into the shape of each of circuit chips cut out of a silicon, is used, and the circuit chips are arranged according to the opening configuration of the mask by passing them through its openings.
申请公布号 JP2001267333(A) 申请公布日期 2001.09.28
申请号 JP20000077180 申请日期 2000.03.17
申请人 SEIKO EPSON CORP 发明人 ABE DAISUKE
分类号 H01L25/18;G09F9/00;H01L21/50;H01L25/04;(IPC1-7):H01L21/50 主分类号 H01L25/18
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