| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method, that achieve sure electrical conduction between a protruding electrode of a semiconductor element and a terminal electrode of a circuit board. SOLUTION: A semiconductor element 6 is opposed to an insulating material 4, which insulates the terminal electrode 2 and a wiring pattern 3 of the circuit board 1, via a cured resin material 9. The protruding electrode 8 of the semiconductor element 6 is in contact with the terminal electrode 2 and has an outward expanding part 8a on a contact surface.
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