发明名称 APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and method, which enables cycle time to be reduced for improving the productivity. SOLUTION: In the method of picking up a chip 3 from a feeder 1 with a mounting head 8 to mount it on a substrate 13 held by a substrate holder 11, a one-dimensional camera 9 is mounted movably on a mounting head moving table 6, together with the mounting head 8. In the mounting operation, the camera 9 scans take one-dimensional images of the chip 3 on the feeder 1 and the substrate 13, and two-dimensional images of the chip 3 and the substrate 13 are obtained from these one-dimensional images to recognize their positions. As a result, the image are recognized efficiently by a single image recognizing means, without having the camera 9 suspended and the head 8 during photographing, and the mounting cycle time can be reduced.
申请公布号 JP2001267335(A) 申请公布日期 2001.09.28
申请号 JP20000077618 申请日期 2000.03.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IRITA RYOICHI
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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