| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape BGA semiconductor package which is excellent in mass productivity and electric reliability. SOLUTION: In the tape BGA semiconductor package, a semiconductor element 6 is mounted on a first region on a metallic plate 15 as a reinforcing and heat-radiating plate, a TAB tape 20 having a predetermined wiring pattern 2 is bonded on a second region on the metallic plate 15, the semiconductor element 6 and the wiring pattern 2 are connected by bonding wires 4, and a solder ball 1 is positioned on the side of the tape 20 opposed to the plate 15. An opening 9 to the plate 15 is made in the tape 20, a plated layer 11 having an exposed surface facing the opening 9 is provided on the plate 15, and a grounding wire of the wiring pattern 2 of the tape 20 is electrically connected with the plated layer 11 at the exposed surface of the plate 15 by means of a conductive member (the solder 9 or bonding wire 4) provided in the opening 9. |
