| 摘要 |
PROBLEM TO BE SOLVED: To reduce production cost by simplifying the assembling process of a semiconductor device. SOLUTION: Thin film-like dumps B1, B2 are respectively provided on activated surfaces 10a, 20a of a master chip 10 and a slave chip 20. First and second low elastic coating films 15, 25 made of a polyimide resin or the like are formed, so as to expose the bumps and set to a semicured states. The chips 10 and 20 are superposed by counter posing the activated surfaces 20a, 20b. In states, in which the bumps B1, B2 are bonded and the films 15, 25 are superposed, they are cured (made into imide).Thus, the films 15, 25 are integrated. |
