| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a lead frame warped upwards in an en-bloc mold for forming resin moldings en bloc on the upside of the lead frame which previously mounted elements and connected electrically them. SOLUTION: To cope with the upward warp of a lead frame due to the thermal expansion coefficient difference between resin moldings, in the step of forming the resin moldings en bloc on the upside of the lead frame, the lead frame uses a lead frame, having at least the frame body and leads and connections of each unit, all formed of appropriate wall thicknesses, it is pasted to a sheet 12 and cut into individual units as resin-sealed semiconductor devices so as to cause warp, and the entire unit including leads 4 is ground at the backside into a thin unit by a grinder or other grinding means 14, thus obtaining resin-sealed semiconductor devices. |
