发明名称 METHOD OF MANUFACTURING ALUMINUM OXIDE FILM USED IN SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of an oxide film for increasing grow the rate of an aluminum oxide film. SOLUTION: The manufacturing method of an aluminum oxide film used in a semiconductor is provided with a first step for supplying a semiconductor substrate and placing the semiconductor substrate in a chamber, a second step for simultaneously supplying aluminum source substance and ammonia gas into the chamber and adsorbing them with the semiconductor substrate, a third step for supplying nitrogen gas into the chamber or executing vacuum purge and discharging MTMA which does not react and by-products, a fourth step for supplying an oxygen source substance into the chamber and adsorbing it by the semiconductor substrate, and a fifth step for supplying nitrogen gas in to the chamber or executing vacuum purge and discharging an oxygen source which does not react and by-products.
申请公布号 JP2001267316(A) 申请公布日期 2001.09.28
申请号 JP20010000160 申请日期 2001.01.04
申请人 发明人
分类号 H01L21/31;C23C16/40;C23C16/44;C23C16/455;H01L21/316;H01L21/822;H01L21/8246;H01L27/04;H01L27/105;(IPC1-7):H01L21/316 主分类号 H01L21/31
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