| 摘要 |
PROBLEM TO BE SOLVED: To keep insulating resistance by preventing the penetration of water, steam, etc., by densifying the top surface of a ceramic wiring board without spoiling debinding property, to reduce trouble accompanying wet type processing such as plating by improving washability by decreasing air pores present on the top surface, and to reduce trouble accompanying processing for coating the surface such thin-film formation. SOLUTION: Ceramic which is easier to densify than a green sheet forming a base material is made into paste at the highest temperature of a burning stage, and the paste is arranged on a green sheet forming a top surface and sintered to provide a ceramic multi-layered wiring board which have its surface air pores reduced. |
