| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-radiation structure of an electronic part where heat-radiation effect is improved. SOLUTION: A high-frequency power amplifier 10 is housed in a case 16 which is joined to a heat radiation member 18 through a meandering fine heat pipe 20. The case 16 can cause a gap C under thermal strain at cutting work, however, the heat pipe 20 is deformed by following the shape of the gap C under press-fitting at mounting, resulting in eliminated gap C. Thus, the heat pipe 20 makes a tight contacts with a groove 16d where deflection occurs along the entire surface in Y-direction. A soft plating 22 coated on the outside surface of the heat pipe 20 is softened and deformed by press fitting, and allowed to flow to surely blocks the gap C. |
