发明名称 PHENOLIC RESIN FOR PHOTORESIST
摘要 PROBLEM TO BE SOLVED: To provide a phenolic resin for a high resolution photoresist having both high heat resistance and high sensitivity. SOLUTION: The phenolic resin is obtained by reacting specified phenols with formaldehyde and/or p-formaldehyde in the presence of an acidic catalyst and has a weight average molecular weight of 1,500-15,000. The following regions (A), (B) and (C) of the resin are 10-45%, 35-85% and 0-40%, respectively, and the area ratio of (the region B)+(the region C) to the region A is 1.2-4.5. The sum of the regions (A), (B) and (C) is 100%. The region (A) is the area of the molecular weight range of 150 to <500 (with the exception of free phenols), the region (B) is the area of the molecular weight range of 500 to <5,000 and the region (C) is the area of the molecular weight range of >=5,000.
申请公布号 JP2001264974(A) 申请公布日期 2001.09.28
申请号 JP20000073451 申请日期 2000.03.16
申请人 SUMITOMO DUREZ CO LTD 发明人 NAKANISHI KAZUO;ONISHI OSAMU;NISHISAKO HIROSHI;ARITA YASUSHI
分类号 G03F7/023;C08G8/08;C08G8/12;H01L21/027 主分类号 G03F7/023
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