| 摘要 |
PURPOSE: An earphone speaker is provided, in which wires are processed according to a primary bonding work to minimize distortion of a diaphragm and give good sound quality. CONSTITUTION: An earphone speak includes a yoke, a magnet(64) and a magnet plate(66), a PCB(68), a vibrating film(72), a grill cap(82), and a damper(88). The first accommodation space(50) is formed inside the yoke, and a rivet hole is formed at the center of the bottom of the first accommodation space. The second and third accommodation spaces(56,58) having different diameters are formed outside the first accommodation space. The magnet and the magnet plate are fixed inside the first accommodation space. The PCB is fixed to the bottom side of the yoke. The vibrating film is mounted on the third accommodation space and is constructed in a manner that a voice coil(80) having the first and second wires(76,78) is wound in a ring shape. The grill cap is fixed to the third accommodation space. The damper is fixed to the bottom side of the second accommodation space. A wire output hole(62) is formed at the side wall placed between the bottom of the second accommodation space and the bottom of the third accommodation space. The wires are point-combined with the PCB according to one-time bonding process.
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