| 摘要 |
The present invention provides a multilayer ceramic package, which comprises a conductive layer, formed like a square film (11), applying a power voltage VDD or a ground voltage VSS to a semiconductor device, and having a square hole in its central portion, a plurality of inner leads connected to the conductive layer at the inner portion of the conductive layer, and a plurality of outer leads connected to the conductive layer at the outer portion of the conductive layer, wherein if a first contact point between the inner lead and the conductive layer, a second contact point between the outer lead and conductive layer, a distance between adjacent two first contact points is C1, a distance between adjacent two second contact points is C2, a shortest distance from the first contact point to the second con-tact point is h, both C1/h and C2/h are 3/8 or less. <IMAGE> |
