发明名称 |
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURE THEREOF, CIRCUIT BOARD, AND ELECTRONIC DEVICE |
摘要 |
A plurality of resin layers (40, 100), wiring (20) connected electrically to electrodes (14) of semiconductor elements (12) and external terminals (30) connected electrically to the wiring are formed on a collection (10) of the semiconductor elements (12). The collection (10) is cut. At least one of the resin layers (40, 100) is deviated from the regions (70) where the collection (10) is cut. |
申请公布号 |
WO0171805(A1) |
申请公布日期 |
2001.09.27 |
申请号 |
WO2001JP02325 |
申请日期 |
2001.03.23 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KUWABARA, KEIJI;HANAOKA, TERUNAO;ITO, HARUKI |
分类号 |
H01L21/56;H01L21/78;H01L23/31;H01L23/485 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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