发明名称 |
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
摘要 |
A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed. |
申请公布号 |
US2001023979(A1) |
申请公布日期 |
2001.09.27 |
申请号 |
US20010855617 |
申请日期 |
2001.05.15 |
申请人 |
BROUVILLETTE DONALD W.;COOK ROBERT F.;FERENCE THOMAS G.;HOWELL WAYNE J.;LINIGER ERIC G.;MENDELSON RONALD L. |
发明人 |
BROUVILLETTE DONALD W.;COOK ROBERT F.;FERENCE THOMAS G.;HOWELL WAYNE J.;LINIGER ERIC G.;MENDELSON RONALD L. |
分类号 |
B23D59/00;B28D5/02;H01L21/301;H01L21/607;H01L21/78;H01L29/06;(IPC1-7):H01L29/06 |
主分类号 |
B23D59/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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