发明名称 LEAD-FREE SOLDER ALLOY
摘要 <p>A lead-free solder alloy, characterized as having the following composition: Cu: 0.05 to 2.0 wt %, Ni: 0.001 to 2.0 wt %, balance: Sn. The solder alloy is completely free of Pb, and hence does not cause the environmental pollution by Pb. Further, the solder alloy can provide improved mechanical strength of a soldered joint part as a result of the alloying defined above.</p>
申请公布号 WO2001070448(P1) 申请公布日期 2001.09.27
申请号 JP2000001636 申请日期 2000.03.17
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