| 摘要 |
The manufacturing method has a carrier band (11) fed through a chip deposition device, e.g. a pick-and-place machine, for depositing spaced pre-fabricated electronic chips along the length of the carrier band, with a metallized plastics or metal foil supplied to the carrier band or the electronic chips, for provision of chip contact elements which are connected to the contact surfaces of each chip. An independent claim for a device for an electronic chip carrier band is also included. |
