| 摘要 |
PROBLEM TO BE SOLVED: To aim at shortening the wire length between module circuit boards and improvement of degree of freedom of an electrical characteristic such as impedance. SOLUTION: Rear faces 9, 18 side of the first and second sockets 2, 3 are mutually opposed, and arranged on the same face of motherboard 1, and the motherboard is made as a multilayer structure, and via wiring patterns 27, 29 formed in each layer of motherboard 9, respective terminals 7, 8, 20, 21 of the first and second socket are mutually connected.
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