CRACK STOPPER OF LOW PERMITTIVITY INTEGRATED CIRCUIT AND OXYGEN BARRIER

摘要

PROBLEM TO BE SOLVED: To provide a copper interconnecting integrated circuit of low permittivity, where corrosion of interconnection is reduced, when a crack stopper adjacent to a trimmed edge is used also as a primary barrier to diffusion of oxygen in dielectrics. SOLUTION: A corresponding crack stopper element is formed simultaneously with formation of a circuit interconnection element. For example, a horizontal interconnection element has a structure corresponding to the crack stopper, and a via between interconnection layers also has a structure corresponding to the crack stopper.