| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image pickup device and its manufacturing method, which can reduce the man-hours of a bonding process, can improve bonding quality and facilitate integration of the device into peripheral apparatus. SOLUTION: A transparent board 10 has protruding electrode connection electrode terminals 11 and so on, which are composed of layer-built insulating thin films and conductive thin films, and an electrode terminal group 12, which is formed on the outer side in order to output electrical signals to an external apparatus. A solid-state image pickup device 20 which has respective 1st protruding electrodes 21 and so on, which correspond to the protruding electrode connection electrode terminals 11 and so on of the transparent board 10 and are formed on respective electrical signal input/output terminals 22 so on, is mounted on the transparent board 10 in a face-down manner. The protruding electrode connection electrode terminals 11 and so on of the transparent board 10 and the respective 1st protruding electrodes 21 and so on of the solid-state image pickup device 20 are connected to each other through ultrasonic bonding.
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