发明名称 MATERIALS HAVING LOW DIELECTRIC CONSTANTS AND METHODS OF MAKING
摘要 <p>The invention relates to a material including carbon, oxygen, silicon and hydrogen and having a dielectric constant of from about 2.1 to about 3.0 where an FTIR scan of the material includes at least two major peaks signifying Si-CH3 bonding. The invention further relates to a material which has a variable dielectric constant through the thickness of the material. Another aspect of the invention is the method of making the material.</p>
申请公布号 WO2001071776(A2) 申请公布日期 2001.09.27
申请号 US2001008840 申请日期 2001.03.20
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