BASE MATERIAL FOR A PRINTED CIRCUIT BOARD FORMED FROM A THREE-DIMENSIONAL WOVEN FIBER STRUCTURE

摘要

A base material for use in a printed circuit board, the base material formed from a three dimensional woven fabric (10) having a crimp-free fiber architecture in an x-y plane, the base material comprising a first system of straight first fibres (X) extending along a first direction in a first plane, a second system of straight second fibers (Y) extending along a second direction in a second plane parallel to the first plane, a third system of third fibers (Z) extending along a third direction through the first and second systems and binding the first and second fibers thereof, and a filler material coating at least a portion of the first, second, and third systems.