发明名称 Plasma-assisted dry etching of noble metal-based materials
摘要 A process for removing and/or dry etching noble metal-based material structures, e.g., iridium for electrode formation for a microelectronic device. Etch species are provided by plasma formation involving energization of one or more halogenated organic and/or inorganic substance, and the etchant medium including such etch species and oxidizing gas is contacted with the noble metal-based material under etching conditions. The plasma formation and the contacting of the plasma with the noble metal-based material can be carried out in a downstream microwave processing system to provide processing suitable for high-rate fabrication of microelectronic devices and precursor structures in which the noble metal forms an electrode, or other conductive element or feature of the product article.
申请公布号 US2001024679(A1) 申请公布日期 2001.09.27
申请号 US20010874102 申请日期 2001.06.05
申请人 ADVANCED TECHNOLOGY MATERIALS INC. 发明人 BAUM THOMAS H.;CHEN PHILLIP;DIMEO FRANK;VAN BUSKIRK PETER C.;KIRLIN PETER S.
分类号 C07F15/00;C23C16/18;C23C16/40;C23F1/30;C30B25/02;H01L21/02;H01L21/3213;(IPC1-7):B05D3/00;B05D5/12;C23F1/00 主分类号 C07F15/00
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