| 摘要 |
A substrate for mounting an electronic part or parts thereon, which comprises a core substrate and at least a set of insulation layer and patterned wiring line layer, which is formed on the insulation layer, at at least one side of the core substrate, the core substrate having holes, in each of which a lead pin of the electronic part to be mounted is to be inserted, and being provided with lands which surround the opening of the hole and to which the lead pin inserted in the hole is to be bonded, wherein the insulation layer or layers at at least one side of the core substrate has bores, which expose the land at their bottoms, and communicate with the hole. A method of manufacturing such a substrate is also disclosed.
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