| 摘要 |
<p>A hole structure having fine openings and drilled deep through holes, and a production method therefor. The hole structure is characterized by having through holes having first openings and second openings larger in size than the first openings, the size d of second openings being at least 2 mu m and up to 50 mu m, the depth t of through holes being larger than d and up to 15d. The production method is characterized by comprising the step of forming an opaque, conductive layer in a specified pattern on a transparent substrate, the step of forming a photosensitive, insoluble material layer on one opaque, conductive layer-formed surface of the transparent substrate, the step of exposing the photosensitive, insoluble material layer to light from the other surface, on which the opaque, conductive layer is not formed, of the transparent substrate, the step of developing the photosensitive, insoluble material to form a resist compatible with a specified pattern, and the step of forming a hole structure on one resist-formed surface by an electroplating method.</p> |
