发明名称 Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate
摘要 In a substrate on which a ball grid allay type electrical part is mounted includes a substrate body, a normal land, an integrated land and a connection reinforcement section. The substrate body provided with a ball grid allay type electrical part. On the normal land, a normal electrode of the ball grid array type electrical part is connected. On the integrated land, a plurality of integrated electrodes of the ball grid allay type electrical part is connected. The connection reinforcement section connects to the integrated land to the substrate body
申请公布号 US2001023782(A1) 申请公布日期 2001.09.27
申请号 US20010855620 申请日期 2001.05.16
申请人 NAKAMURA TAISUKE 发明人 NAKAMURA TAISUKE
分类号 H01L23/12;H01L23/498;H05K1/11;H05K3/34;(IPC1-7):H05K1/16 主分类号 H01L23/12
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