Manufacture of package with at least two memory chips - contacting chips with external lead-frame, and connecting chips to internal lead-frame held with tape pieces

摘要

The method involves contacting the memory chips (1,2) with an external lead-frame (4,5). The memory chips are connected together by an internal lead-frame (6). Tape pieces are applied to the internal lead-frame during manufacture to hold the internal lead-frame in position relative to the memory chips. After application of the tape pieces, the internal lead-frame holder is removed by stamping and the internal lead-frame is held to the chips only by the tape pieces.