| 摘要 |
<p>A system is disclosed for isolating a bond pad (2) from the rest of the circuitry of a semiconductor chip (4) in a manner that protects the chip from applied signals that are outside the normal operating range and which tamper with the operation of the system. The system includes the use of a controllable switch (8) for routing the signal from the bond pad to the circuit and a detector for detecting a tamper condition on the bond pad. The detection of a tamper condition causes the detector to inform the microcontroller on the chip to, for example, terminate the operation in progress, perform a controlled system shutdown, disable pre-arranged functions, or record the fact that a tamper condition occurred.</p> |
