Solution for removing thermal grease from electronic cards

摘要

A water-free solution and method for dissolving and removing thermal grease from a high frequency logic device (e.g. a microprocessor in the form of a BGA and ASIC in the form of Quad Flat Pack component) assembled onto an electronic card which needs to be reworked. The method and solution of the present invention allow the complete removal of the grease by a simple and fast process, using an alcoholic, inert and cheap solution, without needing a mechanical action (e.g. brushing) and without damaging the card components. Furthermore, given the low surface tension of the alcoholic solution a good diffusion within the small holes and spaces of the card is ensured.