| 摘要 |
The wetting, removal of gas bubbles and improvement of material exchange in both through and blind holes in circuit boards (LP) is not possible with conventional devices and methods without further application. In particular, very narrow holes, with large aspect ratios create difficult problems. According to the invention, the above problem is resolved by means of a meth od comprising the following method steps: the circuit boards (LP) are transport ed through a treatment unit (1), by means of transport means (13, 14), in a horizontal transport path and on a transport plane (2) and there brought int o contact with a treatment fluid. An impulse generator mechanism (50) transmit s mechanical impulses direct to the circuit board (LP) by means of the transpo rt means (13, 14), and/or the treatment fluid.
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