发明名称 METHOD FOR PRODUCING SOLID PHASE DIFFUSION-JOINED SPUTTERING TARGET ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a sputtering target assembly having high joining strength, at the time of laminating a target material and a backing plate material and performing diffusion joining, by increasing the contact area of both materials. SOLUTION: The indentations in the joining face of at least either a target material or a backing plate material are filled with fine powders, the surfaces are made smooth, the contact face at the time of laminating of both materials is widen, and, after that, diffusion joining is performed by heating and pressurizing.
申请公布号 JP2001262331(A) 申请公布日期 2001.09.26
申请号 JP20000080797 申请日期 2000.03.22
申请人 VACUUM METALLURGICAL CO LTD 发明人 KASHU SEIICHIRO;MIHARA YASUO;HAYASHI CHIKARA;KIN YUTAKA
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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