SEMICONDUCTOR PACKAGE MAGAZINE

摘要

PURPOSE: A semiconductor package magazine is provided to reduce time and cost necessary for manufacturing the semiconductor package magazine, by separately manufacturing a plurality of upper/lower plates satisfying various specifications of a body and a semiconductor strip, and by assembling the upper/lower plates to form the semiconductor package magazine so that semiconductor strips of various specifications can be loaded without a separate magazine. CONSTITUTION: A semiconductor package magazine(30) is loaded in a semiconductor package process to transfer a semiconductor strip. The semiconductor strip is loaded in a body(31,31'). A plurality of guides is formed on respective surfaces of the body. Upper/lower plates(32,33) have the width corresponding to the width of the semiconductor strip separated from the body. A coupling unit couples the body with the upper/lower plates.