| 摘要 |
PROBLEM TO BE SOLVED: To accurately detect defects, such as thinning, thickening, chipping, bending, and leaning, of a wired terminal portion, based on images inputted by a photographing system having relatively low resolution. SOLUTION: An IL(inner lead) portion characteristic-extracting means 102 extracts the area of an IL by measuring the reflection luminance level of an object of inspection. A line profile measuring means 103 measures widthwise line profiles of the IL at a plurality of positions. An IL portion width calculating means 105 determines line profiles, having widths larger than a prescribed threshold, to be the width profiles of the IL among those measured by the means 103, thus finding their widths. An IL width abnormal portion detecting means 106 detects abnormalities in the width of the IL. An IL width center calculating means 107 takes the width center position of the found width profiles as the center position of a pattern. An IL shape abnormality detecting means 108 detects abnormality in the shape of the IL from the state where the center position change dependent on the respective width profiles. |
