| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is used for sealing semiconductors and has excellent ordinary temperature preservability, excellent fast curability and excellent solder crack resistance. SOLUTION: This epoxy resin composition for sealing semiconductors, characterized by containing (A) an epoxy resin obtained by glycidyl-etherifying the mixture of (a) a bisphenol F compound with (b) a phenol compound as the precursor of a crystalline epoxy resin, (B) a modified novolak type phenolic resin, (C) an inorganic filler, and (D) a curing accelerator which is the molecular association product (M) of a tetrasubstituted phosphonium (X) with a compound (Y) containing two or more phenolic hydroxy groups in the molecule and has a phosphonium-phenoxide type salt in the structure, as essential components.
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