发明名称 PHENOLIC RESIN MOLDING MATERIAL COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a phenolic resin molding material having excellent abrasion resistance by imparting excellent moisture resistance, heat resistance, electric properties, flame retardancy, tracking resistance and the like, which are needed in electronic and electric part items, and further preventing malfunction such as contact failure due to abrasion powder at sliding parts. SOLUTION: A phenolic resin molding material composition containing a phenolic resin, an organic filler and an inorganic filler, as essential components. The phenolic resin molding material composition is compounded with 0.5-5.0 wt.% of powder of low-density polyethylene resin having a number average molecular weight of <=30,000, as an abrasion property-improving agent.
申请公布号 JP2001261928(A) 申请公布日期 2001.09.26
申请号 JP20000079246 申请日期 2000.03.16
申请人 HITACHI CHEM CO LTD 发明人 ITO TAKUJI;IKEGAMI HISAO;TOMITA KYOICHI
分类号 C08J5/16;C08K3/00;C08K5/00;C08L61/06;(IPC1-7):C08L61/06 主分类号 C08J5/16
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