发明名称 PHENOLIC RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a phenolic resin molding material which has excellent luster in appearance and little change in appearance by hygroscopic treatment. SOLUTION: The phenolic resin molding material is composed of 20-45 wt.% of 60-mesh passing crushed matter of cured product of a thermosetting resin and 5-30 wt.% of 100-mesh passing fine powder of an organic filler based on the total of the molding materials.
申请公布号 JP2001261926(A) 申请公布日期 2001.09.26
申请号 JP20000071704 申请日期 2000.03.15
申请人 SUMITOMO BAKELITE CO LTD 发明人 IKEDA SHINJI
分类号 C08L61/04;C08L101/00;(IPC1-7):C08L61/04 主分类号 C08L61/04
代理机构 代理人
主权项
地址