| 摘要 |
PROBLEM TO BE SOLVED: To achieve a miniaturization and a higher reliability of an elastic surface wave device which has a package where a piezo-electric element with an elastic surface wave element formed therein is carried by a flip tip bonding technique. SOLUTION: There are arranged a package having a linear expansion coefficient and a piezo-electric element which has an elastic surface wave element formed therein and is carried on the package by flip tip bonding. The piezo-electric element has a long side thereof in the direction in which the linear expansion coefficient thereof is different between that in the ongoing direction of an elastic surface wave generated by a comb-shaped electrode of the elastic surface wave element and that in the direction vertical thereto while being close to that of the package. As one example, the piezo-electric element is cut out of a single crystal having crystal axes X, Y and Z and the crystal axis X coincides with the direction of the propagation of the elastic surface wave.
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